Optimization of a pin surface as a solution to suppress cavity modes in a packaged W-band microstrip receiver
Ver/
Fecha
2014Versión
Acceso abierto / Sarbide irekia
Tipo
Artículo / Artikulua
Versión
Versión aceptada / Onetsi den bertsioa
Impacto
|
10.1109/TCPMT.2014.2312252
Resumen
A pin surface structure has been used in the upper
metal plate of a packaged W-band RF front-end receiver in order
to suppress the propagation of unwanted modes. A full parametric
analysis of the periodic structure within the irreducible
Brillouin zone has been carried out in order to understand
the behavior of the pin surface and determine the optimum
dimensions for its operation in the full W-b ...
[++]
A pin surface structure has been used in the upper
metal plate of a packaged W-band RF front-end receiver in order
to suppress the propagation of unwanted modes. A full parametric
analysis of the periodic structure within the irreducible
Brillouin zone has been carried out in order to understand
the behavior of the pin surface and determine the optimum
dimensions for its operation in the full W-band. Resonances
suppression has been demonstrated in the W-band both in
simulation and experimentally. [--]
Materias
Lid of nails,
Microstrip packaging,
Pin surface,
W-band receiver.
Editor
IEEE
Publicado en
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 6, June 2014
Departamento
Universidad Pública de Navarra. Departamento de Ingeniería Eléctrica y Electrónica /
Nafarroako Unibertsitate Publikoa. Ingeniaritza Elektrikoa eta Elektronikoa Saila
Versión del editor
Entidades Financiadoras
This work was supported by the Spanish Ministry
of Science and Innovation under Project TEC2009-11995, Project IPT-2011-
0960-390000, and Project CONSOLIDER CSD2008-00066.