Optimization of a pin surface as a solution to suppress cavity modes in a packaged W-band microstrip receiver

Rebollo Mugueta, Ainara; Gonzalo García, Ramón; Ederra Urzainqui, Íñigo

doi:10.1109/TCPMT.2014.2312252

dc.creator	Rebollo Mugueta, Ainara	es_ES
dc.creator	Gonzalo García, Ramón	es_ES
dc.creator	Ederra Urzainqui, Íñigo	es_ES
dc.date.accessioned	2017-08-04T09:21:21Z
dc.date.available	2017-08-04T09:21:21Z
dc.date.issued	2014
dc.identifier.citation	A. Rebollo, R. Gonzalo and I. Ederra, "Optimization of a Pin Surface as a Solution to Suppress Cavity Modes in a Packaged W-Band Microstrip Receiver," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 6, pp. 975-982, June 2014. doi: 10.1109/TCPMT.2014.2312252.	en
dc.identifier.issn	2156-3950 (Print)
dc.identifier.issn	2156-3985 (Electronic)
dc.identifier.uri	https://hdl.handle.net/2454/24940
dc.description.abstract	A pin surface structure has been used in the upper metal plate of a packaged W-band RF front-end receiver in order to suppress the propagation of unwanted modes. A full parametric analysis of the periodic structure within the irreducible Brillouin zone has been carried out in order to understand the behavior of the pin surface and determine the optimum dimensions for its operation in the full W-band. Resonances suppression has been demonstrated in the W-band both in simulation and experimentally.	en
dc.description.sponsorship	This work was supported by the Spanish Ministry of Science and Innovation under Project TEC2009-11995, Project IPT-2011- 0960-390000, and Project CONSOLIDER CSD2008-00066.	en
dc.format.extent	8 p.
dc.format.mimetype	application/pdf	en
dc.language.iso	eng	en
dc.publisher	IEEE	en
dc.relation.ispartof	IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 6, June 2014	en
dc.rights	© 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.	en
dc.subject	Lid of nails	en
dc.subject	Microstrip packaging	en
dc.subject	Pin surface	en
dc.subject	W-band receiver.	en
dc.title	Optimization of a pin surface as a solution to suppress cavity modes in a packaged W-band microstrip receiver	en
dc.type	Artículo / Artikulua	es
dc.type	info:eu-repo/semantics/article	en
dc.contributor.department	Ingeniería Eléctrica y Electrónica	es_ES
dc.contributor.department	Ingeniaritza Elektrikoa eta Elektronikoa	eu
dc.rights.accessRights	Acceso abierto / Sarbide irekia	es
dc.rights.accessRights	info:eu-repo/semantics/openAccess	en
dc.identifier.doi	10.1109/TCPMT.2014.2312252
dc.relation.projectID	info:eu-repo/grantAgreement/MICINN//TEC2009-11995/ES/	en
dc.relation.publisherversion	https://doi.org/10.1109/TCPMT.2014.2312252
dc.type.version	Versión aceptada / Onetsi den bertsioa	es
dc.type.version	info:eu-repo/semantics/acceptedVersion	en

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