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dc.creatorRebollo Mugueta, Ainaraes_ES
dc.creatorGonzalo García, Ramónes_ES
dc.creatorEderra Urzainqui, Íñigoes_ES
dc.date.accessioned2017-08-04T09:21:21Z
dc.date.available2017-08-04T09:21:21Z
dc.date.issued2014
dc.identifier.citationA. Rebollo, R. Gonzalo and I. Ederra, "Optimization of a Pin Surface as a Solution to Suppress Cavity Modes in a Packaged W-Band Microstrip Receiver," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 6, pp. 975-982, June 2014. doi: 10.1109/TCPMT.2014.2312252.en
dc.identifier.issn2156-3950 (Print)
dc.identifier.issn2156-3985 (Electronic)
dc.identifier.urihttps://hdl.handle.net/2454/24940
dc.description.abstractA pin surface structure has been used in the upper metal plate of a packaged W-band RF front-end receiver in order to suppress the propagation of unwanted modes. A full parametric analysis of the periodic structure within the irreducible Brillouin zone has been carried out in order to understand the behavior of the pin surface and determine the optimum dimensions for its operation in the full W-band. Resonances suppression has been demonstrated in the W-band both in simulation and experimentally.en
dc.description.sponsorshipThis work was supported by the Spanish Ministry of Science and Innovation under Project TEC2009-11995, Project IPT-2011- 0960-390000, and Project CONSOLIDER CSD2008-00066.en
dc.format.extent8 p.
dc.format.mimetypeapplication/pdfen
dc.language.isoengen
dc.publisherIEEEen
dc.relation.ispartofIEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 6, June 2014en
dc.rights© 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectLid of nailsen
dc.subjectMicrostrip packagingen
dc.subjectPin surfaceen
dc.subjectW-band receiver.en
dc.titleOptimization of a pin surface as a solution to suppress cavity modes in a packaged W-band microstrip receiveren
dc.typeArtículo / Artikuluaes
dc.typeinfo:eu-repo/semantics/articleen
dc.contributor.departmentUniversidad Pública de Navarra. Departamento de Ingeniería Eléctrica y Electrónicaes_ES
dc.contributor.departmentNafarroako Unibertsitate Publikoa. Ingeniaritza Elektriko eta Elektronikoa Sailaeu
dc.rights.accessRightsAcceso abierto / Sarbide irekiaes
dc.rights.accessRightsinfo:eu-repo/semantics/openAccessen
dc.identifier.doi10.1109/TCPMT.2014.2312252
dc.relation.projectIDinfo:eu-repo/grantAgreement/ES/6PN/TEC2009-11995
dc.relation.publisherversionhttps://doi.org/10.1109/TCPMT.2014.2312252
dc.type.versionVersión aceptada / Onetsi den bertsioaes
dc.type.versioninfo:eu-repo/semantics/acceptedVersionen


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