Monitoring the etching process in LPFGs towards development of highly sensitive sensors
Fecha
2017Autor
Versión
Acceso abierto / Sarbide irekia
Tipo
Contribución a congreso / Biltzarrerako ekarpena
Versión
Versión publicada / Argitaratu den bertsioa
Identificador del proyecto
ES/1PE/TEC2016-78047-R
Impacto
|
10.3390/proceedings1040331
Resumen
In this work, the monitoring of the etching process up to a diameter of 30 µm of two LPFG structures has been compared, one of them had initially 125 µm, whereas the second one had 80 µm. By tracking the wavelength shift of the resonance bands during the etching process it is possible to check the quality of etching process (the 80 µm fibre performs better than de 125 µm fibre), and to stop for a ...
[++]
In this work, the monitoring of the etching process up to a diameter of 30 µm of two LPFG structures has been compared, one of them had initially 125 µm, whereas the second one had 80 µm. By tracking the wavelength shift of the resonance bands during the etching process it is possible to check the quality of etching process (the 80 µm fibre performs better than de 125 µm fibre), and to stop for a specific cladding mode coupling, which permits to obtain an improved sensitivity compared to the initial structure. [--]
Materias
Etching,
Long period fiber grating,
Optic fibre sensor,
Refractive index
Editor
MDPI
Publicado en
Proceedings, 1(4), 331
Notas
Trabajo presentado en la Eurosensors 2017 Conference. París, 3–6 de septiembre de 2017.
Departamento
Universidad Pública de Navarra. Departamento de Ingeniería Eléctrica y Electrónica /
Nafarroako Unibertsitate Publikoa. Ingeniaritza Elektrikoa eta Elektronikoa Saila /
Universidad Pública de Navarra/Nafarroako Unibertsitate Publikoa. Institute for Advanced Materials - INAMAT
Versión del editor
Entidades Financiadoras
This work was supported by the Spanish Agencia Estatal de Investigación (AEI) and Fondo Europeo de Desarrollo Regional (FEDER) TEC2016-78047-R and by the Government of Navarre through its projects with references: 2016/PI008, 2016/PC025 and 2016/PC026.