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dc.creatorRodríguez García, Antonioes_ES
dc.creatorPérez Artieda, Miren Gurutzees_ES
dc.creatorBeisti Antoñanzas, Irenees_ES
dc.creatorAstrain Ulibarrena, Davides_ES
dc.creatorMartínez Echeverri, Álvaroes_ES
dc.date.accessioned2020-07-02T06:50:31Z
dc.date.available2021-02-11T00:00:14Z
dc.date.issued2020
dc.identifier.issn0361-5235
dc.identifier.urihttps://hdl.handle.net/2454/37271
dc.description.abstractDuring thermal design in the first phases development, thermoelectric systems, such as thermoelectric generators, the most important parameter affecting the performance is thermal resistance of the components. This paper focusses on the thermal contact resistance (TCR), analyzing the influence of aging and temperature on different thermal interface materials (TIMs), i.e., thermal paste, graphite and indium. In previous papers, TCR has been studied depending on parameters such as surface roughness, bonding pressure, thermal conductivity and surface hardness. However, in thermoelectric applications, a relevant aspect to consider when choosing a TIM is aging due to thermal stress. The exposure of this type of material to high temperatures for long periods of time leads to deterioration, which causes an increase in the TCR impairing the conduction of the heat flow. Therefore, there is a need to study the behavior of TIMs exposed to temperatures typical in thermoelectric generators to make a correct selection of the TIM. It has been observed that exposure to temperatures of around 180°C induces a significant increase in the thermal impedance of the three TIMs under study, although this effect is much more relevant for thermal paste. The contact, comprising steel, thermal paste and ceramic, presents a 300% increase in the thermal impedance after 70 days of aging, whereas that exceeds 185% for the contact of aluminum, thermal paste and ceramic. In the tests with exposure temperature of 60°C, there is no observed decrease in the thermal impedance.en
dc.description.sponsorshipThe authors are indebted to the Spanish Ministry of Economy and Competitiveness, and the European Regional Development Fund for economic support to this work, included in the RTI2018-093501-B-C22 research project.en
dc.format.extent18 p.
dc.format.mimetypeapplication/pdfen
dc.language.isoengen
dc.publisherSpringeren
dc.relation.ispartofJournal of Electronic Materials, 2020, 49, 2943-2953en
dc.rights© 2020 The Minerals, Metals & Materials Societyen
dc.subjectThermal contact resistanceen
dc.subjectThermoelectric devicesen
dc.subjectThermal interface materialen
dc.subjectThermal agingen
dc.subjectCeramic steel contacten
dc.subjectCeramic aluminum contacten
dc.titleInfluence of temperature and aging on the thermal contact resistance in thermoelectric devicesen
dc.typeinfo:eu-repo/semantics/articleen
dc.typeArtículo / Artikuluaes
dc.contributor.departmentUniversidad Pública de Navarra. Departamento de Ingenieríaes_ES
dc.contributor.departmentNafarroako Unibertsitate Publikoa. Ingeniaritza Sailaeu
dc.contributor.departmentUniversidad Pública de Navarra / Nafarroako Unibertsitate Publikoa. ISC - Institute of Smart Citieses_ES
dc.rights.accessRightsinfo:eu-repo/semantics/openAccessen
dc.rights.accessRightsAcceso abierto / Sarbide irekiaes
dc.embargo.terms2021-02-11
dc.identifier.doi10.1007/s11664-020-08015-y
dc.relation.publisherversionhttps://doi.org/10.1007/s11664-020-08015-y
dc.type.versioninfo:eu-repo/semantics/acceptedVersionen
dc.type.versionVersión aceptada / Onetsi den bertsioaes


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