A novel 0.3-0.31 THz GaAs-based transceiver with on-chip slotted metamaterial antenna based on SIW technology
Fecha
2020Autor
Versión
Acceso abierto / Sarbide irekia
Tipo
Contribución a congreso / Biltzarrerako ekarpena
Versión
Versión aceptada / Onetsi den bertsioa
Impacto
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10.1109/APMC46564.2019.9038371
Resumen
This paper presents a novel on-chip antenna with fully integrated 0.3-0.31 THz transceiver is implemented on 0.5μm GaAs substrate, and comprises a voltage-controlled oscillator (VCO), a buffer amplifier, a modulator stage, a power-amplifier, a frequency-tripler, and an on-chip antenna. The proposed on-chip antenna design is based on metamaterial (MTM) slots and substrate integrated waveguide (SIW ...
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This paper presents a novel on-chip antenna with fully integrated 0.3-0.31 THz transceiver is implemented on 0.5μm GaAs substrate, and comprises a voltage-controlled oscillator (VCO), a buffer amplifier, a modulator stage, a power-amplifier, a frequency-tripler, and an on-chip antenna. The proposed on-chip antenna design is based on metamaterial (MTM) slots and substrate integrated waveguide (SIW) technologies. The SIW antenna operates as a high-pass filter and an on-chip radiator to suppress the unwanted harmonics and radiate the desired signal, respectively. Dimensions of the on-chip antenna are 2×1×0.0006 mm3. The proposed on-chip antenna has an average radiation gain and efficiency of >1.0 dBi and 55%, respectively. The transceiver provides an average output power of-15 dBm over 0.3-0.31 THz, which is suitable for near-field active imaging applications at terahertz region. [--]
Materias
On-chip antenna,
Metamaterial,
Terahertz (THz),
Substrate integrated waveguide (SIW),
Transceiver,
Gallium Arsenide (GaAs) substrate,
Longitudinal and transverse slot arrays
Editor
IEEE
Publicado en
Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference (APMC): 10-13 December 2019, Marina Bay Sands, Singapore, 69-71
Departamento
Universidad Pública de Navarra. Departamento de Ingeniería Eléctrica, Electrónica y de Comunicación /
Nafarroako Unibertsitate Publikoa. Ingeniaritza Elektrikoa, Elektronikoa eta Telekomunikazio Ingeniaritza Saila
Versión del editor
Entidades Financiadoras
This work is partially supported by innovation programme under grant agreement H2020-MSCA-ITN-2016 SECRET-722424 and the financial support from the UK EPSRC under grant EP/E022936/1.