(IEEE, 2022) Lezaun Capdevila, Carlos; Jorajuria Gómez, Tania; Torres García, Alicia E.; Herrera, Pilar; Beruete Díaz, Miguel; Ingeniería Eléctrica, Electrónica y de Comunicación; Institute of Smart Cities - ISC; Ingeniaritza Elektrikoa, Elektronikoaren eta Telekomunikazio Ingeniaritzaren
A newly design method for designing multi-layered radiative cooling metamaterials based on genetic algorithms (GAs) is exposed. The developed GA has been tested in three cases, resulting in three different structures that achieve, theoretically under direct sunlight, a net cooling power of 39.96 W/m 2 , 57.78 W/m 2 and 61.77 W/m 2 . Such devices are composed of 9, 15 and 24 layers respectively with a total thickness of less than 4.8 µm in the worst case. By the nature of the method, fewer design experience in metamaterials is needed, as well as it is free-cost, due to the use of analytical calculations for the emissivity of the meta materials instead of a commercial generic electromagnetic solver. Automated design of radiative cooling multi-layered structures and other applications in the infrared range can be further developed with this work.
(IEEE, 2022) Lezaun Capdevila, Carlos; Jorajuria Gómez, Tania; Torres García, Alicia E.; Herrera, Pilar; Beruete Díaz, Miguel; Institute of Smart Cities - ISC; Ingeniería Eléctrica y Electrónica; Ingeniaritza Elektrikoa eta Elektronikoa; Gobierno de Navarra / Nafarroako Gobernua
In this work we present a novel way to design thinfilm radiative cooling metamaterials based on genetic algorithms.
Three simulations with different design constraints have been
done, resulting in three structures that achieve 39.96 W/m2
, 57.78
W/m2 and 61.77 W/m2 under direct sunlight, respectively. These
structures are shorter than 5 µm of height and are composed of 9,
15 and 24 layers. This design method has the advantages of being
automatable, needs fewer design experience in metamaterials and
does not rely on commercial simulators. This work opens the path
to an easy way of automated design of thin-film multi-layered
devices for radiative cooling and other applications in the infrared
range.
