Person: Arregui Padilla, Iván
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Arregui Padilla
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Iván
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Ingeniería Eléctrica, Electrónica y de Comunicación
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ISC. Institute of Smart Cities
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0000-0003-2933-1471
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9751
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Publication Open Access Robust design of 3D-printed W-band bandpass filters using gap waveguide technology(Springer, 2022) Santiago Arriazu, David; Tamayo-Domínguez, Adrián; Gómez Laso, Miguel Ángel; Lopetegui Beregaña, José María; Fernández-González, José Manuel; Martínez, Ramón; Arregui Padilla, Iván; Ingeniaritza Elektrikoa, Elektronikoaren eta Telekomunikazio Ingeniaritzaren; Institute of Smart Cities - ISC; Ingeniería Eléctrica, Electrónica y de Comunicación; Universidad Pública de Navarra / Nafarroako Unibertsitate PublikoaIn this paper, a W-band 3D-printed bandpass filter is proposed. The use of higher-order TE10n modes in groove gap waveguide (GGW) technology is evaluated in order to alleviate the manufacturing requirements. In addition to the use of higher-order modes, the coupling between them is analyzed in detail to improve the overall fabrication robustness of the component. This allows the implementation of narrow-band filters operating at millimeter-wave frequency bands (or above), which usually demand complex manufacturing techniques to provide the high accuracy required for this kind of devices. In order to show the applicability of the proposed method, a narrow-band 5th-order Chebyshev bandpass filter centered at 94 GHz, which can be easily fabricated by state-of-the-art stereolithographic (SLA) 3D-printing techniques followed by silver coating, is shown. Excellent measured performance has been obtained.Publication Open Access Metal 3D printing for RF/microwave high-frequency parts(Springer, 2022) Martín Iglesias, Petronilo; Gómez Laso, Miguel Ángel; Lopetegui Beregaña, José María; Teberio Berdún, Fernando; Arregui Padilla, Iván; Marechal, M.; Calves, P.; Hazard, M.; Pambaguian, L.; Brandao, A.; Rodríguez Castillo, S.; Martin, T.; Percaz Ciriza, Jon Mikel; Iza, V.; Martín-Iglesias, Santiago; Ingeniería Eléctrica, Electrónica y de Comunicación; Ingeniaritza Elektrikoa, Elektronikoaren eta Telekomunikazio IngeniaritzarenSpace Systems have been historically characterised by high performance, high reliability and high cost. Every new generation of space systems tends to improve performance, keep as much as possible reliability, speeding the lead time and lower the cost. Aggressive approach is nowadays followed by some of the players of the new space ecosystem where, for instance, reli- ability can be relaxed thanks for the in-orbit redundancy or robustness to failures by having a constellation with a high number of satellites. This push towards the technology and system limit requires to investigate new methods for the manufacturing of RF/Microwave parts. RF devices such as those based on waveguide structures, benefit from an additive manufacturing approach in terms of radio frequency (RF) performance and compactness. However each manufacturing approach comes with specific features and limitations which need to be well understood and, in some cases, even taking advantage of them. This paper provides a short review of some of the RF/Microwave parts already manufactured using this technology. The paper will focus mainly on metal 3D printing parts since this technology is, at the moment, well accepted by the space community.