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dc.creatorCarbajo Deán, Juan Andréses_ES
dc.date.accessioned2016-11-30T11:18:19Z
dc.date.available2016-11-30T11:18:19Z
dc.date.issued2016
dc.identifier.urihttps://hdl.handle.net/2454/22844
dc.description.abstractThe Cu-Bi alloys are important from a technological point of view. Copper-Bismuth alloys are part of lead-free solders that are being studied nowadays. A good thermodynamic description of this system is essential for further investigations of multi-components materials that include Cu and Bi. Due to the frequent use of Cu as a substrate material in electronics, it is of importance to understand the interactions between the solders materials and the substrate. A new assessment was proposed in this work based on multiple published experimental reports. Calculations of the thermodynamic properties have been carried out following the CALPHAD method, and using the ThermoCalc software. Good agreement between calculations and experimental data was found, and a now database considering the Cu-Bi alloy has been performed.en
dc.format.mimetypeapplication/pdfen
dc.language.isoengen
dc.subjectCopper-bismuth alloysen
dc.subjectThermodynamicsen
dc.titleThermodynamic description of the binary cu-bi systemen
dc.typeTrabajo Fin de Máster/Master Amaierako Lanaes
dc.typeinfo:eu-repo/semantics/masterThesisen
dc.contributor.affiliationNational Dong Hwa University (Taiwan)en
dc.contributor.affiliationEscuela Técnica Superior de Ingenieros Industriales y de Telecomunicaciónes_ES
dc.contributor.affiliationTelekomunikazio eta Industria Ingeniarien Goi Mailako Eskola Teknikoaeu
dc.description.degreeMáster Universitario en Ingeniería Industrial por la Universidad Pública de Navarraes_ES
dc.description.degreeNafarroako Unibertsitate Publikoko Unibertsitate Masterra Industria Ingeniaritzaneu
dc.rights.accessRightsAcceso abierto / Sarbide irekiaes
dc.rights.accessRightsinfo:eu-repo/semantics/openAccessen
dc.contributor.advisorTFELópez Taberna, Jesúses_ES
dc.contributor.advisorTFEGierlotka, Wojcieches_ES


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