Thermodynamic description of the binary cu-bi system

Abstract

The Cu-Bi alloys are important from a technological point of view. Copper-Bismuth alloys are part of lead-free solders that are being studied nowadays. A good thermodynamic description of this system is essential for further investigations of multi-components materials that include Cu and Bi. Due to the frequent use of Cu as a substrate material in electronics, it is of importance to understand the interactions between the solders materials and the substrate. A new assessment was proposed in this work based on multiple published experimental reports. Calculations of the thermodynamic properties have been carried out following the CALPHAD method, and using the ThermoCalc software. Good agreement between calculations and experimental data was found, and a now database considering the Cu-Bi alloy has been performed.