Decoupling of multifrequency dipole antenna arrays for microwave imaging applications
Ver/
Fecha
2010Versión
Acceso abierto / Sarbide irekia
Tipo
Artículo / Artikulua
Versión
Versión publicada / Argitaratu den bertsioa
Impacto
|
10.1155/2010/843624
Resumen
The mutual coupling between elements of a multifrequency dipole antenna array is experimentally investigated by S-parameter
measurements and planar near-field scanning of the radiated field. A multifrequency array with six dipoles is analyzed. In order to
reduce the coupling between dipoles, a planarmetasurface is placed atop the array acting as superstrate. Themutual coupling of the
antenna e ...
[++]
The mutual coupling between elements of a multifrequency dipole antenna array is experimentally investigated by S-parameter
measurements and planar near-field scanning of the radiated field. A multifrequency array with six dipoles is analyzed. In order to
reduce the coupling between dipoles, a planarmetasurface is placed atop the array acting as superstrate. Themutual coupling of the
antenna elements in the absence and presence of the superstrate is presented comparatively. Between 3 and 20 dB mutual coupling
reduction is achieved when the superstrate is used. By scanning the field radiated by the antennas and far-field measurements of
the radiation pattern, it is observed that the superstrate confines the radiated power, increases the boresight radiation, and reduces
the endfire radiation. [--]
Materias
Decoupling,
Multifrequency dipole antenna arrays,
Superstrates
Editor
Hindawi Publishing Corporation
Publicado en
International Journal of Antennas and Propagation Volume 2010 (2010), Article ID 843624
Departamento
Universidad Pública de Navarra. Departamento de Ingeniería Eléctrica y Electrónica /
Nafarroako Unibertsitate Publikoa. Ingeniaritza Elektrikoa eta Elektronikoa Saila
Versión del editor
Entidades Financiadoras
This research has been financially supported by METAMORPHOSE
NoE funded by E. C. under contract no. NMP3-
CT-2004-50252 and Spanish Government under project
no. TEC2006-13248-C04-03/TCM.