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    Optimization of a pin surface as a solution to suppress cavity modes in a packaged W-band microstrip receiver

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    Pub411.pdf (2.239Mb)
    Date
    2014
    Author
    Rebollo Mugueta, Ainara Upna
    Gonzalo García, Ramón Upna Orcid
    Ederra Urzainqui, Íñigo Upna Orcid
    Version
    Acceso abierto / Sarbide irekia
    Type
    Artículo / Artikulua
    Version
    Versión aceptada / Onetsi den bertsioa
    Project Identifier
    ES/6PN/TEC2009-11995 
    Impact
     
     
     
    10.1109/TCPMT.2014.2312252
     
     
     
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    Abstract
    A pin surface structure has been used in the upper metal plate of a packaged W-band RF front-end receiver in order to suppress the propagation of unwanted modes. A full parametric analysis of the periodic structure within the irreducible Brillouin zone has been carried out in order to understand the behavior of the pin surface and determine the optimum dimensions for its operation in the full W-b ... [++]
    A pin surface structure has been used in the upper metal plate of a packaged W-band RF front-end receiver in order to suppress the propagation of unwanted modes. A full parametric analysis of the periodic structure within the irreducible Brillouin zone has been carried out in order to understand the behavior of the pin surface and determine the optimum dimensions for its operation in the full W-band. Resonances suppression has been demonstrated in the W-band both in simulation and experimentally. [--]
    Subject
    Lid of nails, Microstrip packaging, Pin surface, W-band receiver.
     
    Publisher
    IEEE
    Published in
    IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 6, June 2014
    Departament
    Universidad Pública de Navarra. Departamento de Ingeniería Eléctrica y Electrónica / Nafarroako Unibertsitate Publikoa. Ingeniaritza Elektriko eta Elektronikoa Saila
     
    Publisher version
    https://doi.org/10.1109/TCPMT.2014.2312252
    URI
    https://hdl.handle.net/2454/24940
    Sponsorship
    This work was supported by the Spanish Ministry of Science and Innovation under Project TEC2009-11995, Project IPT-2011- 0960-390000, and Project CONSOLIDER CSD2008-00066.
    Appears in Collections
    • Artículos de revista DIEE - IEES Aldizkari artikuluak [359]
    • Artículos de revista - Aldizkari artikuluak [4205]
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