Optimization of a pin surface as a solution to suppress cavity modes in a packaged W-band microstrip receiver
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Date
2014
Version
Acceso abierto / Sarbide irekia
Type
Artículo / Artikulua
Version
Versión aceptada / Onetsi den bertsioa
Project Identifier
ES/6PN/TEC2009-11995
Impact
Abstract
A pin surface structure has been used in the upper
metal plate of a packaged W-band RF front-end receiver in order
to suppress the propagation of unwanted modes. A full parametric
analysis of the periodic structure within the irreducible
Brillouin zone has been carried out in order to understand
the behavior of the pin surface and determine the optimum
dimensions for its operation in the full W-b ...
[++]
Subject
Lid of nails,
Microstrip packaging,
Pin surface,
W-band receiver.
Publisher
IEEE
Published in
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 6, June 2014
Departament
Universidad Pública de Navarra. Departamento de Ingeniería Eléctrica y Electrónica /
Nafarroako Unibertsitate Publikoa. Ingeniaritza Elektriko eta Elektronikoa Saila
Publisher version
Sponsorship
This work was supported by the Spanish Ministry
of Science and Innovation under Project TEC2009-11995, Project IPT-2011-
0960-390000, and Project CONSOLIDER CSD2008-00066.
