Silicon carbide as a material-based high-impedance surface for enhanced absorption within ultra-thin metallic films

Date
2020Author
Version
Acceso abierto / Sarbide irekia
Type
Artículo / Artikulua
Version
Versión publicada / Argitaratu den bertsioa
Project Identifier
Impact
|
10.1364/OE.402397
Abstract
The absorption of infrared radiation within ultra-thin metallic films is technologically relevant for different thermal engineering applications and optoelectronic devices, as well as for fundamental research on sub-nanometer and atomically-thin materials. However, the maximal attainable absorption within an ultra-thin metallic film is intrinsically limited by both its geometry and material prope ...
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The absorption of infrared radiation within ultra-thin metallic films is technologically relevant for different thermal engineering applications and optoelectronic devices, as well as for fundamental research on sub-nanometer and atomically-thin materials. However, the maximal attainable absorption within an ultra-thin metallic film is intrinsically limited by both its geometry and material properties. Here, we demonstrate that material-based high-impedance surfaces enhance the absorptivity of the films, potentially leading to perfect absorption for optimal resistive layers, and a fourfold enhancement for films at deep nanometer scales. Moreover, material-based high-impedance surfaces do not suffer from spatial dispersion and the geometrical restrictions of their metamaterial counterparts. We provide a proof-of-concept experimental demonstration by using titanium nanofilms on top of a silicon carbide substrate. [--]
Subject
Ultra-thin metallic films,
Absorptivity,
Silicon carbide substrates,
Infrarred radiation,
Material-based high-impedance surfaces
Publisher
Optical Society of America
Published in
Optics Express, 28 (21), 31624-31636
Departament
Universidad Pública de Navarra/Nafarroako Unibertsitate Publikoa. Institute of Smart Cities - ISC /
Universidad Pública de Navarra. Departamento de Ingeniería Eléctrica, Electrónica y de Comunicación /
Nafarroako Unibertsitate Publikoa. Ingeniaritza Elektrikoa, Elektronikoa eta Telekomunikazio Ingeniaritza Saila
Publisher version
Sponsorship
Horizon 2020 Framework Programme (ATTRACT ENZSICSENS); Ministerio de Ciencia, Innovación y Universidades (RTI2018-093714-301 J-I00, RYC2018-024123-I).