Miniaturization trends in substrate integrated waveguide (SIW) filters: a review
Fecha
2020Autor
Versión
Acceso abierto / Sarbide irekia
Tipo
Artículo / Artikulua
Versión
Versión publicada / Argitaratu den bertsioa
Identificador del proyecto
Impacto
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10.1109/ACCESS.2020.3044088
Resumen
This review provides an overview of the technological advancements and miniaturization trends in Substrate Integrated Waveguide (SIW) filters. SIW is an emerging planar waveguide structure for the transmission of electromagnetic (EM) waves. SIW structure consists of two parallel copper plates which are connected by a series of vias or continuous perfect electric conductor (PEC) channels. SIW is a ...
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This review provides an overview of the technological advancements and miniaturization trends in Substrate Integrated Waveguide (SIW) filters. SIW is an emerging planar waveguide structure for the transmission of electromagnetic (EM) waves. SIW structure consists of two parallel copper plates which are connected by a series of vias or continuous perfect electric conductor (PEC) channels. SIW is a suitable choice for designing and developing the microwave and millimetre-wave (mm-Wave) radio frequency (RF) components: because it has compact dimensions, low insertion loss, high-quality factor (QF), and can easily integrate with planar RF components. SIW technology enjoys the advantages of the classical bulky waveguides in a planar structure; thus is a promising choice for microwave and mm-Wave RF components. © 2013 IEEE. [--]
Materias
Coupling topology,
Filters,
Isolation,
Metallic via,
Substrate integrated waveguide (SIW),
Transmission zero (TZ)
Editor
IEEE
Publicado en
IEEE Access, vol. 8, pp. 223287-223305, 2020
Departamento
Universidad Pública de Navarra/Nafarroako Unibertsitate Publikoa. Institute of Smart Cities - ISC /
Universidad Pública de Navarra. Departamento de Ingeniería Eléctrica, Electrónica y de Comunicación /
Nafarroako Unibertsitate Publikoa. Ingeniaritza Elektrikoa, Elektronikoa eta Telekomunikazio Ingeniaritza Saila
Versión del editor
Entidades Financiadoras
This work was supported by the Ministerio de Ciencia, Innovación y Universidades, Gobierno de España under Grant RTI2018-095499-B-C31.