Publication:
Parametric study of pin surface used to suppress undesired modes in a packaged W-band microstrip receiver

Consultable a partir de

Date

2013

Director

Publisher

IEEE
Acceso abierto / Sarbide irekia
Contribución a congreso / Biltzarrerako ekarpena
Versión aceptada / Onetsi den bertsioa

Project identifier

MICINN//TEC2009-11995/ES/

Abstract

A pin surface structure has been used in order to suppress undesired modes in a packaged W-band RF front-end receiver. A parametric analysis has been carried out in order to determine the optimum dimensions. Resonances suppression has been demonstrated.

Keywords

Microstrip packaging, W-band, Pin surface, Lid of nails

Department

Ingeniería Eléctrica y Electrónica / Ingeniaritza Elektrikoa eta Elektronikoa

Faculty/School

Degree

Doctorate program

Editor version

Funding entities

This work was supported by the Spanish Ministry of Science and Innovation Project Nos. TEC2009-11995 and IPT-2011- 0960-390000.

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