Publication:
A Chebyshev transformer-based microstri-to-groove-gap-waveguide inline transition for MMIC packaging

dc.contributor.authorPérez Escudero, José Manuel
dc.contributor.authorTorres García, Alicia E.
dc.contributor.authorGonzalo García, Ramón
dc.contributor.authorEderra Urzainqui, Íñigo
dc.contributor.departmentIngeniaritza Elektrikoa, Elektronikoaren eta Telekomunikazio Ingeniaritzareneu
dc.contributor.departmentInstitute of Smart Cities - ISCen
dc.contributor.departmentIngeniería Eléctrica, Electrónica y de Comunicaciónes_ES
dc.date.accessioned2020-04-14T09:32:12Z
dc.date.available2020-04-14T09:32:12Z
dc.date.issued2019
dc.description.abstractThe gap waveguide technology has become an alternative to millimeter- and submillimeter-wave electronic circuit packaging thanks to the loss reduction associated with its use. In this paper, a simplified design of an inline transition between a microstrip and a groove gap waveguide (GGW) operating at the W-band is presented. The transition consists of a tapered microstrip line and a Chebyshev adapter that couple the quasi-TEM mode of the microstrip line to the so-called vertical mode of the GGW. The simplicity of this design makes this transition appropriate for monolithic microwave integrated circuit (MMIC) packaging at millimeter frequencies and above. The simulation results have been experimentally validated in the W-band. A good performance has been achieved, resulting in a return loss better than 10 dB and a mean insertion loss lower than 2 dB.en
dc.description.sponsorshipThis work was support by the Spanish MINECO under Project TEC2013-47753-C3-1-R and Project TEC2016-76997-C3-1R.en
dc.format.extent9 p.
dc.format.mimetypeapplication/pdfen
dc.identifier.citationJ. M. Pérez-Escudero, A. E. Torres-García, R. Gonzalo and I. Ederra, 'A Chebyshev Transformer-Based Microstri-to-Groove-Gap-Waveguide Inline Transition for MMIC Packaging,' in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 8, pp. 1595-1602, Aug. 2019.en
dc.identifier.doi10.1109/TCPMT.2019.2904430
dc.identifier.issn2156-3950
dc.identifier.urihttps://academica-e.unavarra.es/handle/2454/36719
dc.language.isoengen
dc.publisherIEEEen
dc.relation.ispartofIEEE Transactions on Components Packaging and Manufacturing Technology, 2019, 9 (8), 1595-1602en
dc.relation.projectIDinfo:eu-repo/grantAgreement/MINECO//TEC2013-47753-C3-1-R/ES/en
dc.relation.projectIDinfo:eu-repo/grantAgreement/ES/1PE/TEC2016-76997en
dc.relation.publisherversionhttps://doi.org/10.1109/TCPMT.2019.2904430
dc.rights© 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other work.en
dc.rights.accessRightsinfo:eu-repo/semantics/openAccessen
dc.rights.accessRightsAcceso abierto / Sarbide irekiaes
dc.subjectChebyshev transformeren
dc.subjectGroove gap waveguide (GGW)en
dc.subjectMicrostripen
dc.subjectWaveguide transitionen
dc.titleA Chebyshev transformer-based microstri-to-groove-gap-waveguide inline transition for MMIC packagingen
dc.typeinfo:eu-repo/semantics/articleen
dc.typeArtículo / Artikuluaes
dc.type.versioninfo:eu-repo/semantics/acceptedVersionen
dc.type.versionVersión aceptada / Onetsi den bertsioaes
dspace.entity.typePublication
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relation.isAuthorOfPublication.latestForDiscovery59d1e613-d28a-4a04-a2d3-23bd353c76d1

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