High-gain on-chip antenna design on silicon layer with aperture excitation for terahertz applications
Fecha
2020Autor
Versión
Acceso abierto / Sarbide irekia
Tipo
Artículo / Artikulua
Versión
Versión aceptada / Onetsi den bertsioa
Impacto
|
10.1109/LAWP.2020.3010865
Resumen
This letter investigates the feasibility of designing a high gain on-chip antenna on silicon technology for subterahertz applications over a wide-frequency range. High gain is achieved by exciting the antenna using an aperture fed mechanism to couple electromagnetics energy from a metal slot line, which is sandwiched between the silicon and polycarbonate substrates, to a 15-element array comprisi ...
[++]
This letter investigates the feasibility of designing a high gain on-chip antenna on silicon technology for subterahertz applications over a wide-frequency range. High gain is achieved by exciting the antenna using an aperture fed mechanism to couple electromagnetics energy from a metal slot line, which is sandwiched between the silicon and polycarbonate substrates, to a 15-element array comprising circular and rectangular radiation patches fabricated on the top surface of the polycarbonate layer. An open ended microstrip line, which is orthogonal to the metal slot-line, is implemented on the underside of the silicon substrate. When the open ended microstrip line is excited it couples the signal to the metal slot-line which is subsequently coupled and radiated by the patch array. Measured results show the proposed on-chip antenna exhibits a reflection coefficient of less than-10 dB across 0.290-0.316 THz with a highest gain and radiation efficiency of 11.71 dBi and 70.8%, respectively, occurred at 0.3 THz. The antenna has a narrow stopband between 0.292 and 0.294 THz. The physical size of the presented subterahertz on-chip antenna is 20 × 3.5 × 0.126 mm3. [--]
Materias
Coupling feeding mechanism,
High gain,
Silicon technology,
Terahertz (THz) on-chip antenna,
Terahertz applications,
Wide-frequency range
Editor
IEEE
Publicado en
IEEE Antennas and Wireless Propagation Letters, 2020, 19(9), 1576-1580
Departamento
Universidad Pública de Navarra. Departamento de Ingeniería Eléctrica, Electrónica y de Comunicación /
Nafarroako Unibertsitate Publikoa. Ingeniaritza Elektrikoa, Elektronikoa eta Telekomunikazio Ingeniaritza Saila
Versión del editor
Entidades Financiadoras
This work was supported in part by RTI2018-095499-B-C31, funded by Ministerio de Ciencia, Innovación y Universidades, Gobierno de España (MCIU/AEI/FEDER,UE), and Innovation Programme under Grant agreement H2020-MSCA-ITN-2016 SECRET-722424, and in part by U.K. EPSRC under Grant EP/E022936/1.