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High performance antenna-on-chip inspired by SIW and metasurface technologies for THz band operation
dc.creator | Alibakhshikenari, Mohammad | es_ES |
dc.creator | Virdee, Bal S. | es_ES |
dc.creator | Rajaguru, Renu Karthick | es_ES |
dc.creator | Iqbal, Amjad | es_ES |
dc.creator | Al-Hasan, Muath | es_ES |
dc.creator | See, Chan H. | es_ES |
dc.creator | Falcone Lanas, Francisco Javier | es_ES |
dc.date.accessioned | 2023-03-29T07:20:23Z | |
dc.date.available | 2023-03-29T07:20:23Z | |
dc.date.issued | 2023 | |
dc.identifier.citation | Alibakhshikenari, M., Virdee, B. S., Rajaguru, R. K., Iqbal, A., Al‑Hasan, M., See, C. H., & Falcone, F. (2023). High performance antenna-on-chip inspired by SIW and metasurface technologies for THz band operation. Scientific Reports, 13(1), 56. https://doi.org/10.1038/s41598-022-27364-8 | en |
dc.identifier.issn | 2045-2322 | |
dc.identifier.uri | https://hdl.handle.net/2454/44943 | |
dc.description.abstract | In this paper, a high-performance antenna-on-chip (AoC) is implemented on gallium arsenide (GaAs) wafer based on the substrate integrated waveguide (SIW) and metasurface (MTS) technologies for terahertz band applications. The proposed antenna is constructed using fve stacked layers comprising metal-GaAs-metal-GaAs-metal. The conductive electromagnetic radiators are implemented on the upper side of the top GaAs layer, which has a metallic ground-plane at its underside. The metallic feedline is implemented at the underside of the bottom GaAs layer. Dual wrench-shaped radiators are framed by metallic vias connected to the ground-plane to create SIW cavity. This technique mitigates the surface waves and the substrate losses, thereby improving the antenna’s radiation characteristics. The antenna is excited by a T-shaped feedline implemented on the underside of the bottom GaAs substrate layer. Electromagnetic (EM) energy from the feedline is coupled to the radiating elements through the circular and linear slots etched in the middle ground-plane layer. To mitigate the surfacewave interactions and the substrate losses in the bottom GaAs layer, the feedline is contained inside a SIW cavity. To enhance the antenna’s performance, the radiators are transformed into a metamaterialinspired surface (i.e., metasurface), by engraving periodic arrangement of circular slots of subwavelength diameter and periodicity. Essentially, the slots act as resonant scatterers, which control the EM response of the surface. The antenna of dimensions of 400× 400 × 8 μm3 is demonstrated to operate over a wide frequency range from 0.445 to 0.470THz having a bandwidth of 25GHz with an average return-loss of− 27 dB. The measured average gain and radiation efciency are 4.6 dBi and 74%, respectively. These results make the proposed antenna suitable for AoC terahertz applications. | en |
dc.description.sponsorship | Dr. Mohammad Alibakhshikenari acknowledges support from the CONEX-Plus programme funded by Universidad Carlos III de Madrid and the European Union's Horizon 2020 research and innovation programme under the Marie Sklodowska-Curie grant agreement No. 801538. This work was supported by Ministerio de Ciencia, Innovación y Universidades, Gobierno de España (Agencia Estatal de Investigación, Fondo Europeo de Desarrollo Regional -FEDER-, European Union) under the research grant PID2021-127409OB-C31 CONDOR. | en |
dc.format.mimetype | application/pdf | en |
dc.language.iso | eng | en |
dc.publisher | Springer | en |
dc.relation.ispartof | Scientific Reports (2023) 13(1), 1-13 | en |
dc.rights | © 2023, The Author(s). This article is licensed under a Creative Commons Attribution 4.0 International License. | en |
dc.rights.uri | http://creativecommons.org/licenses/by/4.0/ | |
dc.subject | Hhigh-performance antenna-on-chip | en |
dc.subject | Substrate integrated waveguide | en |
dc.subject | Metasurface technologies | en |
dc.subject | Gallium arsenide | en |
dc.title | High performance antenna-on-chip inspired by SIW and metasurface technologies for THz band operation | en |
dc.type | Artículo / Artikulua | es |
dc.type | info:eu-repo/semantics/article | en |
dc.date.updated | 2023-03-29T07:09:19Z | |
dc.contributor.department | Ingeniería Eléctrica, Electrónica y de Comunicación | es_ES |
dc.contributor.department | Ingeniaritza Elektrikoa, Elektronikoa eta Telekomunikazio Ingeniaritza | eu |
dc.contributor.department | Institute of Smart Cities - ISC | en |
dc.rights.accessRights | Acceso abierto / Sarbide irekia | es |
dc.rights.accessRights | info:eu-repo/semantics/openAccess | en |
dc.identifier.doi | 10.1038/s41598-022-27364-8 | |
dc.relation.projectID | info:eu-repo/grantAgreement/European Commission/Horizon 2020 Framework Programme/801538 | en |
dc.relation.projectID | info:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2021-2023/PID2021-127409OB-C31 | en |
dc.relation.publisherversion | https://doi.org/10.1038/s41598-022-27364-8 | |
dc.type.version | Versión publicada / Argitaratu den bertsioa | es |
dc.type.version | info:eu-repo/semantics/publishedVersion | en |