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dc.creatorDíaz Lucas, Silviaes_ES
dc.creatorFuentes Lorenzo, Omares_ES
dc.creatorTorres Betancourt, Angie Tatianaes_ES
dc.creatorCorres Sanz, Jesús Maríaes_ES
dc.creatorMatías Maestro, Ignacioes_ES
dc.date.accessioned2023-09-18T18:14:15Z
dc.date.available2023-09-18T18:14:15Z
dc.date.issued2023
dc.identifier.citationDiaz, S., Fuentes, O., Torres, A., Corres, J. M., & Matías, I. R. (2023). Highly sensitive sensor for measuring material thermal expansion using a ring laser. IEEE Sensors Letters, 7(10), 1-4. https://doi.org/10.1109/LSENS.2023.3312996.en
dc.identifier.issn2475-1472
dc.identifier.urihttps://hdl.handle.net/2454/46366
dc.description.abstractA new thermal expansion sensor is presented in this letter. It combines an interferometric fiber sensor and an erbium-doped fiber ring laser as the light source. The sensor consists of a combination of single-mode, hollow-core, and no-core mirror fibers. The sensor was tested on two different types of based metal, such as aluminum and steel, giving sensitivities as high as 38.7 and 5.75 nm/°C, respectively, showing good performance.en
dc.description.sponsorshipThis work was supported by the National Research Agency through Spanish project under Grant PID2019-106231RB-I00.en
dc.format.mimetypeapplication/pdfen
dc.language.isoengen
dc.publisherIEEEen
dc.relation.ispartofIEEE Sensors Letters, 7(10), 2023en
dc.rights© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other work.en
dc.subjectSensor phenomenaen
dc.subjectOptical sensorsen
dc.subjectErbium-doped fiber (EDF)en
dc.subjectHollow-core (HC) fiberen
dc.subjectRing laseren
dc.titleHighly sensitive sensor for measuring material thermal expansion using a ring laseren
dc.typeArtículo / Artikuluaes
dc.typeinfo:eu-repo/semantics/articleen
dc.date.updated2023-09-18T17:47:04Z
dc.contributor.departmentIngeniería Eléctrica, Electrónica y de Comunicaciónes_ES
dc.contributor.departmentInstitute of Smart Cities - ISCen
dc.contributor.departmentIngeniaritza Elektrikoa, Elektronikoaren eta Telekomunikazio Ingeniaritzareneu
dc.rights.accessRightsAcceso abierto / Sarbide irekiaes
dc.rights.accessRightsinfo:eu-repo/semantics/openAccessen
dc.identifier.doi10.1109/LSENS.2023.3312996
dc.relation.projectIDinfo:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020/PID2019-106231RB-I00/ES/en
dc.relation.publisherversionhttps://doi.org/10.1109/LSENS.2023.3312996
dc.type.versionVersión aceptada / Onetsi den bertsioaes
dc.type.versioninfo:eu-repo/semantics/acceptedVersionen


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