Optimization of a pin surface as a solution to suppress cavity modes in a packaged W-band microstrip receiver

Date

2014

Director

Publisher

IEEE
Acceso abierto / Sarbide irekia
Artículo / Artikulua
Versión aceptada / Onetsi den bertsioa

Project identifier

  • MICINN//TEC2009-11995/ES/ recolecta
Impacto

Abstract

A pin surface structure has been used in the upper metal plate of a packaged W-band RF front-end receiver in order to suppress the propagation of unwanted modes. A full parametric analysis of the periodic structure within the irreducible Brillouin zone has been carried out in order to understand the behavior of the pin surface and determine the optimum dimensions for its operation in the full W-band. Resonances suppression has been demonstrated in the W-band both in simulation and experimentally.

Description

Keywords

Lid of nails, Microstrip packaging, Pin surface, W-band receiver.

Department

Ingeniería Eléctrica y Electrónica / Ingeniaritza Elektrikoa eta Elektronikoa

Faculty/School

Degree

Doctorate program

item.page.cita

A. Rebollo, R. Gonzalo and I. Ederra, "Optimization of a Pin Surface as a Solution to Suppress Cavity Modes in a Packaged W-Band Microstrip Receiver," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 6, pp. 975-982, June 2014. doi: 10.1109/TCPMT.2014.2312252.

item.page.rights

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