Optimization of a pin surface as a solution to suppress cavity modes in a packaged W-band microstrip receiver
| dc.contributor.author | Rebollo Mugueta, Ainara | |
| dc.contributor.author | Gonzalo García, Ramón | |
| dc.contributor.author | Ederra Urzainqui, Íñigo | |
| dc.contributor.department | Ingeniería Eléctrica y Electrónica | es_ES |
| dc.contributor.department | Ingeniaritza Elektrikoa eta Elektronikoa | eu |
| dc.date.accessioned | 2017-08-04T09:21:21Z | |
| dc.date.available | 2017-08-04T09:21:21Z | |
| dc.date.issued | 2014 | |
| dc.description.abstract | A pin surface structure has been used in the upper metal plate of a packaged W-band RF front-end receiver in order to suppress the propagation of unwanted modes. A full parametric analysis of the periodic structure within the irreducible Brillouin zone has been carried out in order to understand the behavior of the pin surface and determine the optimum dimensions for its operation in the full W-band. Resonances suppression has been demonstrated in the W-band both in simulation and experimentally. | en |
| dc.description.sponsorship | This work was supported by the Spanish Ministry of Science and Innovation under Project TEC2009-11995, Project IPT-2011- 0960-390000, and Project CONSOLIDER CSD2008-00066. | en |
| dc.format.extent | 8 p. | |
| dc.format.mimetype | application/pdf | en |
| dc.identifier.citation | A. Rebollo, R. Gonzalo and I. Ederra, "Optimization of a Pin Surface as a Solution to Suppress Cavity Modes in a Packaged W-Band Microstrip Receiver," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 6, pp. 975-982, June 2014. doi: 10.1109/TCPMT.2014.2312252. | en |
| dc.identifier.doi | 10.1109/TCPMT.2014.2312252 | |
| dc.identifier.issn | 2156-3950 (Print) | |
| dc.identifier.issn | 2156-3985 (Electronic) | |
| dc.identifier.uri | https://academica-e.unavarra.es/handle/2454/24940 | |
| dc.language.iso | eng | en |
| dc.publisher | IEEE | en |
| dc.relation.ispartof | IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 6, June 2014 | en |
| dc.relation.projectID | info:eu-repo/grantAgreement/MICINN//TEC2009-11995/ES/ | |
| dc.relation.publisherversion | https://doi.org/10.1109/TCPMT.2014.2312252 | |
| dc.rights | © 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | en |
| dc.rights.accessRights | info:eu-repo/semantics/openAccess | |
| dc.subject | Lid of nails | en |
| dc.subject | Microstrip packaging | en |
| dc.subject | Pin surface | en |
| dc.subject | W-band receiver. | en |
| dc.title | Optimization of a pin surface as a solution to suppress cavity modes in a packaged W-band microstrip receiver | en |
| dc.type | info:eu-repo/semantics/article | |
| dc.type.version | info:eu-repo/semantics/acceptedVersion | |
| dspace.entity.type | Publication | |
| relation.isAuthorOfPublication | 972e80d1-9b13-4d9d-b3cd-55281d7c1b3d | |
| relation.isAuthorOfPublication | 19cfe58d-81ad-40ba-a32a-5e903e361041 | |
| relation.isAuthorOfPublication | dbe40f43-15e2-46ee-932e-0d66f246b95d | |
| relation.isAuthorOfPublication.latestForDiscovery | 972e80d1-9b13-4d9d-b3cd-55281d7c1b3d |