Compact dual-band terahertz quarter-wave plate metasurface
Fecha
2014Autor
Versión
Acceso abierto / Sarbide irekia
Tipo
Artículo / Artikulua
Versión
Versión aceptada / Onetsi den bertsioa
Impacto
|
10.1109/LPT.2014.2330860
Resumen
A dual-band quarter-wave plate based on a modified extraordinary transmission hole array is numerically analyzed and experimentally demonstrated at terahertz frequencies. To control independently orthogonal polarizations, the original square holes are connected with vertical slits and their lateral straight sides are replaced by meander lines. This smart design enables dual-band operation with un ...
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A dual-band quarter-wave plate based on a modified extraordinary transmission hole array is numerically analyzed and experimentally demonstrated at terahertz frequencies. To control independently orthogonal polarizations, the original square holes are connected with vertical slits and their lateral straight sides are replaced by meander lines. This smart design enables dual-band operation with unprecedented fractional bandwidths in a compact structure. Considering a flattening deviation lower than 40% of the optimum value, a fractional bandwidth of 53.8% and 3.8% is theoretically obtained (16.8% and 2.9% in the experiment) at 1 and 2.2 THz, respectively. At these two frequencies, the structure is 0.13-λ and 0.29-λ thick, respectively. Given the compactness of the whole structure and the performance obtained, this quarter-wave plate is presented as a competitive device for the terahertz band. [--]
Materias
Quarter-wave plate,
Terahertz applications,
Metasurface,
Extraordinary transmission,
Birefringence
Editor
IEEE
Publicado en
IEEE Photonics Technology Letters, 2014, 26(16), 1679-1682
Departamento
Universidad Pública de Navarra. Departamento de Ingeniería Eléctrica y Electrónica /
Nafarroako Unibertsitate Publikoa. Ingeniaritza Elektrikoa eta Elektronikoa Saila
Versión del editor
Entidades Financiadoras
This work was supported by the Spanish Government through the Consolider Engineering Metamaterials under Contract CSD2008-00066 and Contract TEC2011-28664-C02.