Publication:
Highly sensitive sensor for measuring material thermal expansion using a ring laser

Date

2023

Director

Publisher

IEEE
Acceso abierto / Sarbide irekia
Artículo / Artikulua
Versión aceptada / Onetsi den bertsioa

Project identifier

AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020/PID2019-106231RB-I00/ES/recolecta

Abstract

A new thermal expansion sensor is presented in this letter. It combines an interferometric fiber sensor and an erbium-doped fiber ring laser as the light source. The sensor consists of a combination of single-mode, hollow-core, and no-core mirror fibers. The sensor was tested on two different types of based metal, such as aluminum and steel, giving sensitivities as high as 38.7 and 5.75 nm/°C, respectively, showing good performance.

Description

Keywords

Sensor phenomena, Optical sensors, Erbium-doped fiber (EDF), Hollow-core (HC) fiber, Ring laser

Department

Ingeniería Eléctrica, Electrónica y de Comunicación / Institute of Smart Cities - ISC / Ingeniaritza Elektrikoa, Elektronikoaren eta Telekomunikazio Ingeniaritzaren

Faculty/School

Degree

Doctorate program

item.page.cita

Diaz, S., Fuentes, O., Torres, A., Corres, J. M., & Matías, I. R. (2023). Highly sensitive sensor for measuring material thermal expansion using a ring laser. IEEE Sensors Letters, 7(10), 1-4. https://doi.org/10.1109/LSENS.2023.3312996.

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