Publication:
High frequency power transformers with foil windings: maximum interleaving and optimal design

Consultable a partir de

Date

2015

Director

Publisher

IEEE
Acceso abierto / Sarbide irekia
Artículo / Artikulua
Versión aceptada / Onetsi den bertsioa

Project identifier

MINECO//DPI2013-42853-R/ES/recolecta

Abstract

Foil conductors and primary and secondary interleaving are normally used to minimize winding losses in high frequency transformers used for high-current power applications. However, winding interleaving complicates the transformer assembly, since taps are required to connect the winding sections, and also complicates the transformer design, since it introduces a new tradeoff between minimizing losses and reducing the construction difficulty. This paper presents a novel interleaving technique, named maximum interleaving, that makes it possible to minimize the winding losses as well as the construction difficulty. An analytical design methodology is also proposed in order to obtain free cooled transformers with a high efficiency, low volume and, therefore, a high power density. For the purpose of evaluating the advantages of the proposed maximum interleaving technique, the methodology is applied to design a transformer positioned in the 5 kW 50 kHz intermediate high frequency resonant stage of a commercial PV inverter. The proposed design achieves a transformer power density of 28 W/cm3 with an efficiency of 99.8%. Finally, a prototype of the maximum-interleaved transformer is assembled and validated satisfactorily through experimental tests.

Description

Keywords

Foil windings, High frequency, Maximum interleaving, Optimization, Transformer design

Department

Ingeniería Eléctrica y Electrónica / Ingeniaritza Elektrikoa eta Elektronikoa

Faculty/School

Degree

Doctorate program

item.page.cita

E. L. Barrios, A. Urtasun, A. Ursúa, L. Marroyo and P. Sanchis, "High-Frequency Power Transformers With Foil Windings: Maximum Interleaving and Optimal Design," in IEEE Transactions on Power Electronics, vol. 30, no. 10, pp. 5712-5723, Oct. 2015. doi: 10.1109/TPEL.2014.2368832

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